Asia Pacific Field Programmable Gate Array (FPGA) Boholo ba Mmaraka ho Atoloha ho feta 13% CAGR ho fihlela 2026

Mohala India
teratareng

Ho ea ka Rekoto ea Phuputso ea Graphical Research e ncha e bitsoang "Asia Pacific Field Programmable Gate Array (FPGA) Boholo ba Mmaraka, Ka Process Technology (<28 nm, 28 nm - 90 nm,> 90 nm), By Architecture (SRAM, Flash, Anti -fuse), Ka phetolo (FPGA ea maemo a tlase, FPGA ea mahareng, FPGA e phahameng), Ka Kopo (Consumer Electronics, Automotive, Industrial, Communications & Data Center, Aerospace & Defense, Telecom), Tlaleho ea Ts'ebetso ea Indasteri, Lebatooa Ponahalo (China, India, Japane, Australia, Korea Boroa), Kholiseho, Khokahano ea Mmaraka le Tlholisano, 2020 - 2026 ”Boholo bo tla ba ho pota $ 5.5 billion ka 2026.

Kholo ea mmaraka ea Asia Pacific FPGA e hlahisoa ke keketseho ea ts'ebetsong ea mahlale a inthanete a Lintho (IoT) litsing tsa mmuso, libankeng le likhoebong sebakeng seo. FPGA e fana ka melemo e 'maloa lits'ebetsong tsa IoT joalo ka ho tenyetseha ho etsa lisebelisoa le software, ts'ireletso e matla le ho ntlafatsa nako ea ho e rekisa. Mohlala, Mmuso oa India o hlahisitse lenaneo la 'Smart City Mission' bakeng sa nts'etsopele ea meralo ea litoropo e sebelisa mahlale a AI & IoT. Mehato e joalo ea nts'etsopele e kanna ea eketsa ho amoheloa ha lisebelisoa tsa likhomphutha tse kenelletseng, ho ts'ehetsa kholo ea mmaraka lilemong tse tlang.

Karolo ea theknoloji ea ts'ebetso ea <28nm e reretsoe ho hola ho CAGR e fetang 14% 'marakeng oa Asia Pacific FPGA. Kholo e bakoa ke lintlafatso tse tsitsitseng le nts'etsopele ea moralo le theknoloji ea FPGA ho ntlafatsa boiphihlelo ba bareki. Likhamphani tsa tlhahiso ea FPGA ho kenyeletsoa Xilinx, Intel Corporation, le Microchip Technology, hara tse ling li ntse li tsoela pele ho ba le liphetoho tsa mahlale a ts'ebetso karolong ea <28nm mme ka theknoloji ea morao-rao ea 7nm e atlehileng ho rekisoa 'marakeng.

Karolo ea tlhophiso ea FPGA ea maemo a tlase e bonts'a monyetla oa kholo oa kholo 'marakeng, o hola ho CAGR ea 13% nakong ea tatellano ea nako ea bolepi. Keketseho ea karolo ena e bakoa ke keketseho ea tlhokeho ea lisebelisoa tse sebelisang matla a tlase joalo ka lisebelisoa tse nkehang tsa elektroniki, lisebelisoa tse se nang mohala, likoloi le lisebelisoa tsa komporo tsa bohale. Sebopeho sa FPGA se maemong a tlase se fana ka likarolo tse 'maloa ho kenyelletsa ho fokotsa ho rarahana ha chip, matla a tlase a logic le matla a phahameng a matla.

Karolo ea ts'ebeliso ea lisebelisoa tsa elektroniki ea bareki e hakanyetsoa hore e tla hola ho CAGR ea 11% nakong ea ponelopele. Litharollo tsa FPGA li sebelisoa lihlahisoa tse ngata tsa elektroniki tsa bareki ho kenyeletsoa likh'amera tsa dijithale, li-smartphones, likhokahano tsa lipapali le li-TV tse bohlale, har'a tse ling. Likhamphani li shebile ho kenya tšebetsong theknoloji ea AI ho lisebelisoa tsa elektroniki tsa bareki ho fana ka phapang ea sehlahisoa ho linyehelo tsa bona le ho eketsa tlhoko ea bona 'marakeng. Mohlala, ka Phuptjane 2020, Intel Corporation e sebelisane 'moho le Udacity, Inc. ho hlahisa tharollo ea AI-optimized FPGA bakeng sa lisebelisoa tsa AI tse bohale joalo ka li-smartphones, matlapa le tse ling.

Batšehetsi ba bohlokoa 'marakeng oa Asia Pacific FPGA ba shebane le mesebetsi e tsoelang pele ea R&D mme ba talima nts'etsopele ea sehlahisoa le boiphihlelo e le tsela e atlehang ea ho holisa mmaraka. Mohlala, ka Pherekhong 2019, GOWIN Semiconductor Corporation e phatlalalitse mSoC FPGAs ka radio e kopaneng ea Bluetooth 5.0 Low Energy, e fanang ka bokhoni ba ho sebelisa likhomphutha ho latela sebopeho sa FPGA. Tse ling tsa libapali tsa bohlokoa 'marakeng ke AGM Micro, Gowin Semiconductor Corp., Shenzhen Pango Microsystems, Taiwan Semiconductor Production Company (TSMC), le Xian Intelligence Silicon Tech, hara tse ling.

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